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ICS Trusted T8451 24Vdc TMR Digital Output Module 40-Ch
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Published time: 2026-10-28
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ICS Trusted T8451 24Vdc TMR Digital Output Module 40-Ch
Description
The TMR 24 Vdc Digital Output Module is a member of the Trusted range of input/output (I/O) Modules. All Trusted I/O Modules share common functionality and form. At the most general level, all I/O Modules interface to the Inter-Module Bus (IMB), which provides power and allows communication with the TMR Processor. In addition, all Modules have a field interface that is used to connect to Module-specific signals in the field. All Modules are Triple Modular Redundant (TMR).
All High Integrity I/O Modules are made up of four sections: Host Interface Unit (HIU), the Field Interface Unit (FIU), the Field Termination Unit (FTU), and the Front Panel Unit (or FPU).
The TMR 24 Vdc Digital Output Module is a member of the Trusted range of input/output (I/O) Modules. All Trusted I/O Modules share common functionality and form. At the most general level, all I/O Modules interface to the Inter-Module Bus (IMB), which provides power and allows communication with the TMR Processor. In addition, all Modules have a field interface that is used to connect to Module-specific signals in the field. All Modules are Triple Modular Redundant (TMR).
All High Integrity I/O Modules are made up of four sections: Host Interface Unit (HIU), the Field Interface Unit (FIU), the Field Termination Unit (FTU), and the Front Panel Unit (or FPU).
ICS Trusted Series (formerly ICS Triplex, later acquired by Rockwell Automation) is a triple redundancy (TMR) control platform for Safety Instrumentation System (SIS). According to the published spare parts and product information, this series contains a large number of models, covering processors, I/O, communications, power supplies and rack accessories.
Classification of main models
Processor and controller module
T T8110 / T8110B：Trusted TMR main processor module is the core operation unit of the system.
T8311: expansion interface module, which is used to connect the controller rack and expansion rack.
T8312-4/T8312-7: Expansion interface adapters, which are used to connect 4 or 7 expansion racks respectively.
communication module
T8151/T8151B: Communication interface module, providing Ethernet and serial communication ports.
T8153: Communication interface adapter, which is used to provide a physical connection interface for the communication module.
Digital and analog I/O module
T8403: 40-channel TMR digital input module (24VDC).
T8431: 40 channel TMR analog input module.
T8451/T8461: 40 channel TMR digital output module.
T8480：TMR analog output module.
T8442: Special speed monitoring module, commonly used for turbine control.
Power Supply and Rack Accessories
T8231: 750W24VDC power module.
T8293: 15-way fused DC distribution unit.
T8270/T8271: Cooling fan trays with front air intake and top air exhaust respectively.
Field Interface Unit (FIU)
The Field Interface Unit (FIU) is the section of the Module that contains the specific circuits necessary to interface to the particular types of field I/O signals. Each Module has three FIUs, one per slice. For the TMR 24 Vdc Digital Output Module, the FIU contains one stage of the output switch structure and a sigma-delta (ΣΔ) output circuit for each of the 40 field outputs. Two additional ΣΔ circuits provide optional monitoring of the external field I/O supply voltage.
The FIU receives isolated power from the HIU for logic. The FIU provides additional power conditioning for the operational voltages required by the FIU circuitry. An isolated 6.25 Mbit/sec serial link connects each FIU to one of the HIU slices.
The FIU also measures a range of onboard "housekeeping" signals that assist in monitoring the performance and operating conditions of the Module. These signals include power supply voltages, current consumption, onboard reference voltages, and board temperature.
Host Interface Unit (HIU)
The HIU is the point of access to the Inter-Module Bus (IMB) for the Module. It also provides power distribution and local programmable processing power. The HIU is the only section of the I/O Module to directly connect to the IMB Backplane. The HIU is common to most high-integrity I/O types and has
type-dependent and product-range common functions. Each HIU contains three independent slices, commonly referred to as A, B, and C.
All interconnections between the three slices incorporate isolation to help prevent any fault interaction between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one slice has no effect on the operation of the other slices.
The HIU provides the following services common to the Modules in the family:
• High-Speed Fault Tolerant Communications with the TMR Processor via the IMB interface.
• FCR Interconnect Bus between slices to vote incoming IMB data and distribute outgoing I/O Module data to the IMB.
• Galvanically isolated serial data interface to the FIU slices.
• Redundant power sharing of dual 24 Vdc chassis supply voltage and power regulation for logic power to HIU circuitry.
• Magnetically isolated power to the FIU slices.
• Serial data interface to the FPU for Module status LEDs.
• SmartSlot link between Active and Standby Modules for coordination during Module replacement.
• Digital Signal Processing to perform local data reduction and self-diagnostics.
• Local memory resources for storing Module operation, configuration, and field I/O data.
• Onboard housekeeping, which monitors reference voltages, current consumption, and board temperature.
Front Panel Unit (FPU)
The Front Panel Unit (FPU) contains the necessary connectors, switches, logic, and LED indicators for the Front Panel. For every type of Trusted I/O Module, the FPU contains the Slice Healthy, Active/Standby, Educated LED indicators, and the Module removal switches. Additional bicolor LEDs provide status indication for the individual I/O signals. Serial data interfaces connect the FPU to each of the HIU slices to control the LED status indicators and monitor the Module removal switches.
Line Monitoring and Output States
The Module automatically monitors the output channel current and voltage to determine the state of the output channel. The numerical output state and line fault status are reported back to the application and are represented in this table:
It is recommended to fit a dummy load resistor to unused outputs so that a current is drawn that exceeds the NO-LOAD threshold. This will help prevent the Module from signaling a NO-LOAD fault.
Housekeeping
The Output Module automatically performs local measurements of several onboard signals that can be used for detailed troubleshooting and verification of Module operating characteristics. Measurements are made within each slice’s HIU and FIU.
Fault Detection/Testing
Extensive diagnostics provide the automatic detection of Module faults. The TMR architecture of the Output Module and the diagnostics performed verify the validity of all critical circuits. Using the TMR architecture provides a fault-tolerant method to withstand the first fault occurrence on the Module and continue normal output control without interruption in the system or process. Faults are reported to the user through the Healthy status indicators on the Front Panel of the Module and through the information reported to the TMR Processor. Under normal operations, all three Healthy indicators are green. When a fault occurs, one of the Healthy indicators will be flashing red. It is recommended that this condition be investigated, and if the cause is within the Module, it should be replaced.
Module replacement activities depend on the type of spare Module configuration chosen when the system was configured and installed. The Module may be configured with a dedicated Companion Slot or with a SmartSlot for a spare replacement Module.
From the IMB to the field connector, the I/O Module contains extensive fault detection and integrity testing. As an output device, most testing is performed in a non-interfering mode. Data input from the IMB is stored in redundant error-correcting RAM on each slice portion of the HIU. Received data is voted on by each slice. All data transmissions include a confirmation response from the receiver.
Periodically, the TMR Processor commands the onboard Digital Signal Processors (DSPs) to perform a Safety Layer Test (SLT). The SLT results in the DSP verifying with the TMR Processor its ability to process data with integrity. In addition, the DSP uses Cyclical Redundancy Checks (CRC) to verify the variables and configuration stored in Flash memory.
Between the HIU and FIU is a series of galvanically isolated links for data and power. The datalink is synchronized and monitored for variance. Both FIU and HIU have onboard temperature sensors to characterize temperature-related problems.
The power supplies for both the HIU and FIU boards are redundant, fully instrumented, and testable. Together, these assemblies form a Power Integrity Subsystem.
Operation
Front Panel
Status indicators on the Front Panel of the Module provide visual indications of the Module’s operational status and field output status. Each indicator is a bicolor LED. At the top and bottom of each Module is an ejector lever that is used to remove the Module from the Chassis. Limit switches detect the open/closed position of the ejector levers. The ejector levers are normally latched closed when the Module is firmly seated into the Controller or Expander Chassis.
Module Status LEDs
There are six Module status indicators on the Module Front Panel: three Healthy, one Active, one Standby, and one Educated. The Healthy indicators are controlled directly by each Module slice. The Active, Standby, and Educated indicators are controlled by the FPU. The FPU receives data from each of the Module slices. It performs a 2oo3 vote on each data bit from the slices and sets the indicators accordingly.
I/O Status Indicators
There are 40 output channel status indicators on the Module Front Panel, one for each field output. These indicators are controlled by the FPU. The FPU receives data from each of the Module slices. The FPU performs a 2oo3 vote on each data bit from the slices and sets the indicators accordingly.
The output status indicator mode is dependent upon the numerical state of the output channel. Each output state can be defined to have a particular indicator mode: off, green, red, flashing green, or flashing red.
The configurable indicator modes allow users to customize the output status indications to suit individual application requirements. Without customization, the default indicator modes are suitable for line-monitored digital output devices as described in this table:
Off: Output is Off.
Green Output is On.
Green - flashing: No Load, output open circuit.
Red Field short circuit, output overcurrent protection triggered, and
output channel is latched off.
Red - flashing
Channel fault, or no field supply voltage.
The Field Interface Unit (FIU) is the section of the Module that contains the specific circuits necessary to interface to the particular types of field I/O signals. Each Module has three FIUs, one per slice. For the TMR 24 Vdc Digital Output Module, the FIU contains one stage of the output switch structure and a sigma-delta (ΣΔ) output circuit for each of the 40 field outputs. Two additional ΣΔ circuits provide optional monitoring of the external field I/O supply voltage.
The FIU receives isolated power from the HIU for logic. The FIU provides additional power conditioning for the operational voltages required by the FIU circuitry. An isolated 6.25 Mbit/sec serial link connects each FIU to one of the HIU slices.
The FIU also measures a range of onboard "housekeeping" signals that assist in monitoring the performance and operating conditions of the Module. These signals include power supply voltages, current consumption, onboard reference voltages, and board temperature.
Host Interface Unit (HIU)
The HIU is the point of access to the Inter-Module Bus (IMB) for the Module. It also provides power distribution and local programmable processing power. The HIU is the only section of the I/O Module to directly connect to the IMB Backplane. The HIU is common to most high-integrity I/O types and has
type-dependent and product-range common functions. Each HIU contains three independent slices, commonly referred to as A, B, and C.
All interconnections between the three slices incorporate isolation to help prevent any fault interaction between the slices. Each slice is considered a Fault Containment Region (FCR), as a fault on one slice has no effect on the operation of the other slices.
The HIU provides the following services common to the Modules in the family:
• High-Speed Fault Tolerant Communications with the TMR Processor via the IMB interface.
• FCR Interconnect Bus between slices to vote incoming IMB data and distribute outgoing I/O Module data to the IMB.
• Galvanically isolated serial data interface to the FIU slices.
• Redundant power sharing of dual 24 Vdc chassis supply voltage and power regulation for logic power to HIU circuitry.
• Magnetically isolated power to the FIU slices.
• Serial data interface to the FPU for Module status LEDs.
• SmartSlot link between Active and Standby Modules for coordination during Module replacement.
• Digital Signal Processing to perform local data reduction and self-diagnostics.
• Local memory resources for storing Module operation, configuration, and field I/O data.
• Onboard housekeeping, which monitors reference voltages, current consumption, and board temperature.
Front Panel Unit (FPU)
The Front Panel Unit (FPU) contains the necessary connectors, switches, logic, and LED indicators for the Front Panel. For every type of Trusted I/O Module, the FPU contains the Slice Healthy, Active/Standby, Educated LED indicators, and the Module removal switches. Additional bicolor LEDs provide status indication for the individual I/O signals. Serial data interfaces connect the FPU to each of the HIU slices to control the LED status indicators and monitor the Module removal switches.
Line Monitoring and Output States
The Module automatically monitors the output channel current and voltage to determine the state of the output channel. The numerical output state and line fault status are reported back to the application and are represented in this table:
It is recommended to fit a dummy load resistor to unused outputs so that a current is drawn that exceeds the NO-LOAD threshold. This will help prevent the Module from signaling a NO-LOAD fault.
Housekeeping
The Output Module automatically performs local measurements of several onboard signals that can be used for detailed troubleshooting and verification of Module operating characteristics. Measurements are made within each slice’s HIU and FIU.
Fault Detection/Testing
Extensive diagnostics provide the automatic detection of Module faults. The TMR architecture of the Output Module and the diagnostics performed verify the validity of all critical circuits. Using the TMR architecture provides a fault-tolerant method to withstand the first fault occurrence on the Module and continue normal output control without interruption in the system or process. Faults are reported to the user through the Healthy status indicators on the Front Panel of the Module and through the information reported to the TMR Processor. Under normal operations, all three Healthy indicators are green. When a fault occurs, one of the Healthy indicators will be flashing red. It is recommended that this condition be investigated, and if the cause is within the Module, it should be replaced.
Module replacement activities depend on the type of spare Module configuration chosen when the system was configured and installed. The Module may be configured with a dedicated Companion Slot or with a SmartSlot for a spare replacement Module.
From the IMB to the field connector, the I/O Module contains extensive fault detection and integrity testing. As an output device, most testing is performed in a non-interfering mode. Data input from the IMB is stored in redundant error-correcting RAM on each slice portion of the HIU. Received data is voted on by each slice. All data transmissions include a confirmation response from the receiver.
Periodically, the TMR Processor commands the onboard Digital Signal Processors (DSPs) to perform a Safety Layer Test (SLT). The SLT results in the DSP verifying with the TMR Processor its ability to process data with integrity. In addition, the DSP uses Cyclical Redundancy Checks (CRC) to verify the variables and configuration stored in Flash memory.
Between the HIU and FIU is a series of galvanically isolated links for data and power. The datalink is synchronized and monitored for variance. Both FIU and HIU have onboard temperature sensors to characterize temperature-related problems.
The power supplies for both the HIU and FIU boards are redundant, fully instrumented, and testable. Together, these assemblies form a Power Integrity Subsystem.
Operation
Front Panel
Status indicators on the Front Panel of the Module provide visual indications of the Module’s operational status and field output status. Each indicator is a bicolor LED. At the top and bottom of each Module is an ejector lever that is used to remove the Module from the Chassis. Limit switches detect the open/closed position of the ejector levers. The ejector levers are normally latched closed when the Module is firmly seated into the Controller or Expander Chassis.
Module Status LEDs
There are six Module status indicators on the Module Front Panel: three Healthy, one Active, one Standby, and one Educated. The Healthy indicators are controlled directly by each Module slice. The Active, Standby, and Educated indicators are controlled by the FPU. The FPU receives data from each of the Module slices. It performs a 2oo3 vote on each data bit from the slices and sets the indicators accordingly.
I/O Status Indicators
There are 40 output channel status indicators on the Module Front Panel, one for each field output. These indicators are controlled by the FPU. The FPU receives data from each of the Module slices. The FPU performs a 2oo3 vote on each data bit from the slices and sets the indicators accordingly.
The output status indicator mode is dependent upon the numerical state of the output channel. Each output state can be defined to have a particular indicator mode: off, green, red, flashing green, or flashing red.
The configurable indicator modes allow users to customize the output status indications to suit individual application requirements. Without customization, the default indicator modes are suitable for line-monitored digital output devices as described in this table:
Off: Output is Off.
Green Output is On.
Green - flashing: No Load, output open circuit.
Red Field short circuit, output overcurrent protection triggered, and
output channel is latched off.
Red - flashing
Channel fault, or no field supply voltage.
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